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| GP2S60 GP2S60 I Features 1. Subminiature, leadless type. (Dimensions : 3.2x1.7x1.1mm) 2. Soldering reflow. (Peak temperature : 240C, 10s or less) 3. Taped model. (2 000 pcs/reel) 4. Visible light cut-off type. Subminiature, Reflective Type Photointerrupter for Automatic Mounting I Outline Dimensions (0.7) Detector center (Unit : mm) (0.55) (0.63) 0.4 (0.7) I Applications 1. Audio equipment 2. VCR 3. Camcoders 4. Printers 5. CD-ROM drives Emitter center 2.7 3.2 (1.8) Parameter Forward current Reverse voltage Power dissipation Collector-emitter voltage Emitter-collector voltage Collector current Collector power dissipation Total power dissipation Operating temperature Storage temperature * Soldering temperature (Ta=25C) Symbol Rating Unit mA IF 50 V VR 6 mW PD 75 V VCEO 35 V VECO 6 mA IC 20 75 PC mW 100 mW Ptot Topr C -25 to +85 C Tstg -40 to +100 260 C Tsol (0.57) I Absolute Maximum Ratings Input 1.1 Internal connection diagram 2 1 3 4 3 1 2 3 4 4 (0.65) 1.7 2 1 Output Plating area Unspecified tolerance : 0.15mm ( ) : Reference dimensions Anode Collector Emitter Cathode Recommended pattern 2-1 2-1.7 2-1 *For MAX. 5s (0.57) Pattern wiring is not allowed on short-circuit. Tolerance : 0.1mm 2-0.65 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Internet Internet address for Electronic Components Group http://sharp-world.com/ecg/ 2-0.45 portion not to cause 2-0.65 GP2S60 I Electro-optical Characteristics Input Parameter Forward voltage Symbol VF IR ICEO IC ILEAK tr tf Conditions IF=20mA VR=6V VCE=20V VCE=2V, IF=4mA VCE=2V, IF=4mA VCE=2V, IC=100A RL=1 000, d=1mm MIN. - - - 40 - - - TYP. 1.2 - 1 85 - 20 20 MAX. 1.4 10 100 130 500 100 100 (Ta=25C) Unit V A nA A nA s s Reverse current Collector dark current *1 Collector current Transfer charac- *2 Leak current teristics Rise time Response time Fall time Output *1 Refer to Fig.11 *2 No Reflective object I Rank Table Model No. GP2S60 GP2S60A GP2S60B Rank mark Ic(A) 40 to 130 A or B A 40 to 80 B 65 to 130 Conditions IF=4mA VCE=2V Ta=25C Fig.1 Forward Current vs. Ambient Temperature 60 50 Forward current IF (mA) 40 30 20 10 0 -25 Fig.2 Power Dissipation vs. Ambient Temperature 120 100 Power dissipation P (mW) 80 60 40 20 0 -25 Ptot P,PC 0 25 50 75 85 100 0 25 50 75 85 100 Ambient temperature Ta (C) Ambient temperature Ta (C) GP2S60 Fig.3 Forward Current vs. Forward Voltage 500 200 Forward current IF (mA) 100 50 20 Ta=75C 50C 25C Collector current IC (A) 0C -25C 500 400 300 200 100 0 0 0.5 1 1.5 2 2.5 3 0 5 10 15 20 Forward voltage VF (V) Forward current IF (mA) Fig.4 Collector Current vs. Forward Current 700 600 VCE=2V Ta=25C 10 5 2 1 Fig.5 Collector Current vs. Collectoremitter Voltage 600 Ta=25C 500 IF=15mA Fig.6 Relative Collector Current vs. Ambient Temperature 120 100 Relative collector current (%) 80 60 40 20 0 -25 VCE=2V IF=4mA Collector current IC (A) 400 10mA 300 200 100 2mA 0 0 2 4 6 8 10 Collector-emitter voltage VCE (V) 7mA 4mA 0 25 50 75 Ambient temperature Ta (C) Fig.7 Collector Dark Current vs. Ambient Temperature 10-6 5 VCE=20V Collector dark current ICEO (A) 2 10-7 5 2 10-8 5 2 10-9 5 10-10 0 25 50 75 100 Ambient temperature Ta (C) 2 GP2S60 Fig.8 Response Time vs. Load Resistance 1000 VCE=2V IC=100A Ta=25C tr Response time (s) 100 tf Input RD Fig.9 Test Circuit For Response Time VCC RL Input Output Output 10% 90% 10 td td tr ts tf ts 1 0.1 1 10 100 1000 Load resistance RL (k) Fig.10 Relative Collector Current vs. Distance Between Sensor and Aluminum Evaporation Glass 100 90 Relative collector current (%) 80 70 60 50 40 30 20 10 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 VCE=2V IF=4mA Ta=25C L Al evaporation glass Fig.11 Measuring Configulation of Collector Current Aluminum evaporation glass d=1mm glass plate Distance between sensor and Aluminum evaporation glass L (mm) Fig.12 Spectral Sensitivity 100 Ta=25C 80 Relative sensitivity (%) 60 40 20 0 600 700 800 900 1000 1100 1200 Wavelength (nm) GP2S60 Fig.13 Relative Collector Current vs.OMS Card Moving Distance 100 OMS test card d 1mm Sensor + 0 - VCE=2V IF=4mA d=1mm Fig.14 Relative Collector Current vs.OMS Card Moving Distance 100 OMS test card d 1mm Sensor + 0 - VCE=2V IF=4mA d=1mm Relative collector current (%) Relative collector current (%) 80 80 60 60 40 40 20 20 -3 -2 -1 0 1 2 3 4 5 6 -3 -2 -1 0 1 2 3 4 5 6 OMS card moving distance (mm) OMS card moving distance (mm) Fig.15 Reflow Soldering Only one time soldering is available within the temperature profile shown below. Max. 240C 200C 1 to 4C/s Max. 165C 1 to 4C/s 1 to 4C/s 25C Max.10s Max.60s Max.120s Max.90s I Other Precautions An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. So keep the package temperature within that specified in Item 1. Also avoid immersing the resin part in the solder. Even if within the temperature profile above, there is the possibility that the gold wire in package is broken in case that the deformation of PCW gives the affection to lead pins. Please use after confirmation the conditions fully by actual solder reflow machine. NOTICE q The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: - - - Personal computers - -- Office automation equipment - -- Telecommunication equipment [terminal] - - - Test and measurement equipment - - - Industrial control - -- Audio visual equipment - -- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: - -- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) - - - Traffic signals - - - Gas leakage sensor breakers - - - Alarm equipment - -- Various safety devices, etc. (iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: - - - Space applications - -- Telecommunication equipment [trunk lines] - -- Nuclear power control equipment - -- Medical and other life support equipment (e.g., scuba). q q q Contact a SHARP representative in advance when intending to use SHARP devices for any "specific" applications other than those recommended by SHARP or when it is unclear which category mentioned above controls the intended use. If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export such SHARP devices. This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. Contact and consult with a SHARP representative if there are any questions about the contents of this publication. q q q |
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